Vendor / Project: Qualcomm Product: Multiple Chipsets Description: Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. Required Action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. Due Date: 2023-12-26 Ransomware Campaign Use: Unknown CWEs: CWE-416 Notes: This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063
CVE-2023-33063 — Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Kurzinfo
Metadaten
- Original (extern): Link oeffnen
- Veroeffentlicht: 2023-12-05 00:00 UTC
- Importiert: 2026-10-20 22:46 UTC
- CVSS: 7.8
- Quelle-ID:
cisa_kev - uid_hash:
2fa56f239d1c61169aee9e1549c52ca388eae4093773ba38849c86258f5270ba
Inhalt
Verknuepfte CVEs
| CVE-ID | Severity (Quelle) | CVSS (Quelle) | Severity (CVE.org) | CVSS (CVE.org) | EPSS | EPSS-Pctl | Veroeffentlicht (CVE.org) |
|---|---|---|---|---|---|---|---|
HIGH |
7.8 |
HIGH |
7.8 |
2023-12-05 |
Quellen-Details
| Bezeichnung | Name | Kategorie | Tags | Zielgruppe | Sprache | Feed-URL |
|---|---|---|---|---|---|---|
| CISA – Known Exploited Vulnerabilities (KEV) | threat_intel | cisa, kev | - | de | https://raw.githubusercontent.com/cisagov/kev-data/develop/known_exploited_vulnerabilities.json |